Tenders Description & Specification for Plating Spectrometer
Plating Spectrometer
Top-lightening
Test parts can be lifted up and down
High-precision moveable platform
Small collimator
High-resolution detector
Visual operation
Auto locate height
Auto search spot
Mouse locates the test point
Well ray shielding
Super large chamber design
Safe protection of test interface
Technical specifications
Analytical range: from S to U
Simultaneous analysis of at most 24 elements or coating of above 5 layers
Detection limit: 2ppm, analytical content: 2ppm to 99.9%
Coating thickness: 0.005um minimum, within 20um (it depends on different materials)
Micro collimator (minimum diameter: 0.1mm), test spot (within 0.2mm)
High-precision movable platform (position accuracy: below 0.005mm)
Arbitrary multiple optional analysis and identification models
Independent matrix effect correction models
Repeatability of multiple analyses reaches 0.05um (outermost layer Au below 1um)
Working stability over a long period: 0.1um (outermost layer Au below 1um)
Temperature range: 15℃ to 30℃
Power: AC220V±5V, AC purified stabilized voltage power is recommended
Standard configurations
Open sample chamber
Precise 2-D movable sample platform; the detection system can lift up and down to realize 3-D movement.
Double-laser locating device
Organic glass shielding cover
Si-Pin detector
Signal detection circuit
High-voltage power
X-ray tube
Altitude transducer
Protection transducer
Ltekonline are the manufacturers of Plating Spectrometer used to demonstrate engineering principles in Engineering Colleges, Engineering Schools and Coating Thickness Testing Lab for Engineering Teaching Lab in Universities
Categories: Coating Thickness Testing Lab
Tags: Plating Spectrometer