Tenders Description & Specification for Tin Lead Plating Machine
Tin Lead Plating Machine
Double sides, multi layer circuit board etc. non-metal material double side drilling hole protection.
Cathode oscillation technology, prevent concentration gradient, add hole liquid flow. Swing time:3-5 times/minute.
Full ABS engineer plastic machine and inner groove, antiseptic, anti high temperature, anti vibration, technology flow is good, outlook is beautiful.
Technical Specification:
Minimum hole:0.6mm
Max thickness diameter ratio, 3:1
Max panel:400×400mm, it can electroplate for 5 boards at the same time.
Dimension:420×430×420mm
Output voltage:0-15V,adjustable continuously
Output current:0-20A, adjustable continuously.
Ltekonline are the manufacturers of Tin Lead Plating Machine used to demonstrate engineering principles in Engineering Colleges, Engineering Schools and PCB Lab Equipment for Engineering Teaching Lab in Universities
